The Exicor® DUV and Exicor® 193 DUV systems are advanced birefringence measurement platforms designed for deep ultraviolet (DUV) optical lithography applications, enabling precise evaluation of optical materials at their actual wavelength of use.
Trusted by leading lithography optics manufacturers, these systems support critical quality control of lens and photomask materials used in next‑generation semiconductor lithography.
The Exicor® DUV and 193 DUV systems provide industry‑leading capability for measuring low‑level birefringence at deep ultraviolet wavelengths, including 157 nm, 193 nm, and 248 nm, in accordance with the “measure at the wavelength of use” principle required for precision optical materials. The award‑winning Exicor® DUV system was originally developed to evaluate intrinsic birefringence in calcium fluoride (CaF₂) lens materials for 157 nm lithography, while the Exicor® 193 DUV system addresses the demanding optical requirements of 193 nm and immersion lithography systems.
Both platforms are widely used for birefringence inspection of lens blanks and photomask blanks employed in advanced semiconductor lithography. Built with a robust frame and heavy‑duty automated motion control, the systems support large optics up to 400 mm × 400 mm and more than 200 mm thick. The Exicor® DUV system incorporates a localised nitrogen‑purged sample chamber to eliminate oxygen absorption and prevent ozone generation during 157 nm measurements, while purging is not required for 193 nm and 248 nm operation. A large scanning stage and optional Exicor Macro+ software enable unattended, multi‑part automated measurement routines, making these systems well suited for continuous production and optical materials R&D environments.
Exicor® DUV | Exicor® 193 DUV | |
Wavelengths, selectable: | A) 157 nm B) 193 nm C) 248 nm | A) 193 nm B) 248 nm |
Retardation Range: | A) 0.05 to 70+ nm B) 0.05 to 90+ nm C) 0.05 to 120+ nm | A) 0.05 nm to 90+ nm B) 0.05 nm to 120+ nm |
Retardation Resolution / Repeatability1, 2: | 0.01 nm / ± 0.08 nm | 0.01 nm / ± 0.08 nm |
Angular Resolution / Repeatability1: | 0.01° / ± 0.5° | 0.01° / ± 0.5° |
Nitrogen (N2) Gas Purge: | Required (for 157 nm measurements) | Not Required |
Facility Exhaust: | Required (for N2 purge gas removal) | Required (for lamp ozone removal) |
Light Source: | 30W Deuterium Lamp (N2 gas cooled) | 30W Deuterium Lamp (air cooled) |
Measurement Spot Diameter3: | 3mm to 5mm nominal (resolution can be as low as 1mm) | |
Modulation Technique / Frequency: | PEMLabsTM Photoelastic Modulator / 50 kHz and 50/60 kHz | |
Demodulation Analysis Technique: | Hinds Instruments SignalocTM Lock-in Amplifier | |
Measurement Units: | nm (retardation), ° (angle) | |
The Exicor® platform from Hinds Insrtuments is designed to be highly adaptable, enabling custom configuration to meet the specific requirements of advanced birefringence measurement applications. Originally developed for nanometre‑range, industrialised birefringence measurement, Exicor systems were engineered in recognition that polarisation analysis—particularly birefringence measurement—is frequently driven by application‑specific and non‑standard requirements.
Many customer processes are proprietary in nature and require measurement solutions that can be adapted both quickly and cost‑effectively. To support this, Exicor systems utilise a modular architecture, incorporating configurable optical and electronic subsystems that can be assembled and tailored with minimal non‑recurring engineering (NRE) effort. This approach allows customised system configurations to be delivered efficiently, while maintaining proven performance and measurement reliability.
The Exicor product family includes over three dozen system models, a significant proportion of which represent custom or semi‑custom configurations developed to address specific measurement challenges. This flexibility enables Exicor systems to support a wide range of research, development, and production environments where standard, off‑the‑shelf solutions may not be sufficient.
By combining modular system design with advanced polarisation and birefringence measurement technology, Exicor systems provide users with tailored measurement capability—supporting improved process control, enhanced product performance, and increased competitiveness in precision optics and advanced materials markets.
The Exicor® DUV and Exicor® 193 DUV systems are purpose‑built for birefringence measurement at deep ultraviolet (DUV) lithographic wavelengths, supporting critical applications in advanced optical lithography and semiconductor manufacturing. By enabling measurement at the actual wavelength of use, these systems meet the stringent requirements of precision optical materials manufacturers developing next‑generation lithography optics.
Originally developed to evaluate intrinsic birefringence in calcium fluoride (CaF₂) lens materials at 157 nm, the award‑winning Exicor® DUV system remains a primary tool for inspecting lens blanks used in advanced lithographic assemblies. The Exicor® 193 DUV system extends this capability to a broader range of optical materials used in 193 nm and immersion 193 nm lithography, where the highest optical quality and stress control are required.
Both systems are widely used for birefringence inspection of photomask blanks at 157 nm, 193 nm, and 248 nm, helping identify stress‑induced birefringence and material non‑uniformities that can impact photolithographic pattern accuracy and yield. These capabilities make the Exicor® DUV and 193 DUV systems trusted solutions among leading lithography optics manufacturers worldwide.
Designed with a robust frame and heavy‑duty automated motion control, the systems support optical components up to 400 mm × 400 mm and more than 200 mm thick. A large scanning stage allows multiple smaller components to be measured in a single setup, while optional Exicor Macro+ software enables fully automated, unattended scanning routines. This supports long‑duration measurement runs across multiple shifts, maximising throughput in both production and optical materials R&D environments.
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